Facilities
 
Facilities At Cambridge
Fabrication facilities:
  1.  General cleanroom (0.5 µm optical lithography, fluroine and chlorine RIE, RTA, SEM, AFM, O2 plasma clean, sputterer, scriber, bonders)
  2.  Leica VB6 e-beam lithography (<10 nm resolution, 15 nm stitching and alignment)
  3.  Si cleanroom (chemical cleaning, thermal oxide furnace, PECVD SiO2 and Si3N4, amorphous-Si and Al metalisation)
 
Measurement Facilities:
  1.  Bruker 66vs step-scan FTIR with vacuum emission box and Oxford continuous flow cryostat (1.5 K to 300 K). Detectors and beamsplitters for 100 GHz to NIR (QMC liquid He Si bolometer, MCT, DTGS)
  2.  Six Oxford Instruments dilution refrigerators, base temperature ~20 K, magnetic fields up to 18 T and two with rf cabling.
  3.  Four He3 systems with magnets up to 14 T, one with rf cabling
  4.  Numerous He4 cryostats
  5.  Semiconductor parameter analyser, CV profiler